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SWP9-x SEPA Silver Compound

Data sheet

Format: PDF

Size: 229,5 KB


  • high performance thermal conductive paste for all heat sinks


  • very high thermal conduction of 9W/mK
  • silicone-free
  • low thermal resistance
  • over 85% of thermally conductive filler
  • containing silver
  • non-conducting
  • excellent processing properties
  • temperature-stable
  • For short-term use at temperatures of up to approx. 180°C
  • High durability
  • Non-curing
  • Non-corrosive

Additional Information